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Silicon Wafer Etching using Olympus LEXT OLS5100 Meta Description: Know all about the benefits of silicon wafer etching technique using Olympus LEXT OLS5100 laser confocal microscope for micro-texturing of the silicon front surface to improve the performance of solar panels, and the potential gains it can offer solar parks across India.

Government initiatives such as the National Solar Mission are clear indicators that the country is prioritizing meeting its energy demands through renewable sources of energy as opposed to the non-renewable counterparts. The Indian Government aims to achieve a total installed solar capacity of 20 GW by 2022. India has set up over 40 major solar plants that generate a whopping 10+ MW of solar energy to keep the nation thriving, Including the World’s Largest Solar Plant namely, Bhadla Solar Park in Rajasthan’s Jodhpur District. The increasing solar strength and opportunities in the country can be depicted by the following infographic. Silicon Wafer Etching using Olympus LEXT OLS5100

Silicon based solar cells dominate the current photovoltaic market and are preferred by the solar cell industries. Si substrate is used as material for solar cells and microelectromechanical systems (MEMS) and integrated circuit (IC) manufacturing .Because of its environment friendliness, , paramount availability in abundance after oxygen ,high temperature, minimal price, limited current leakage, stability and also low and high power handling capacity. Silicon Wafer Etching using Olympus LEXT OLS5100

Silicon wafer etching is a process to improve light trapping by modifying surface reflectivity of silicon wafer and use it for solar panel manufacturing. This process is called Micro-texturing of the silicon front surface. An alkaline solution is used for the etching process,which is also widely used to form micro-sized pyramidal structures on the silicon surface. Measurement of surface roughness and surface area become important parameters as they increase with increase in etching time depending on the process. So these parameters help us to understand and optimise process required to get desired etching. Silicon Wafer Etching using Olympus LEXT OLS5100

To measure height of pyramids by Conventional techniques like SEM we need to cut samples to see the cross section which makes the process tedious and is not cost effective.

To overcome this we are introducing an easy yet sophisticated solution to the aforesaid problem using Olympus OLS5100 laser Confocal Microscope. Silicon Wafer Etching using Olympus LEXT OLS5100

Benefits of Using Laser Microscope for measuring the height of pyramids in textured silicon substrate during the Silicon Wafer Etching process.

Submicron Level 3D Observation & Measurement: The LEXT OLS5100 confocal laser microscope enables users to observe submicron unevenness and measure it accurately, giving the end user a closer look of the silicon wafer’s texture.

Surface Roughness Measurement: This device allows ISO compliant level measurement of the silicon wafer’s surface roughness. The user can go to arial from line profile enabling a new standard of roughness measurement.

Speedy: This is a non-contact, non-destructive technique of measurement which requires no processing. You can start to measure from the moment you put your sample under the lens.

Functional Capabilities of Laser Scanning Microscope (Silicon Wafer Etching using Olympus LEXT OLS5100)

Etched Silicon Wafer Image @ 2000x Zoom

Olympus OLS5100 captures height of individual peak using profile line and maximum peak for specific region as Sp value other important parameters to understand surface texture are surface roughness, surface area and volume of pyramid .There is need to destroy sample and it’s also non-contact so no contamination is induced during analysis. Silicon Wafer Etching using Olympus LEXT OLS5100

Measurement of Height (Silicon Wafer Etching using Olympus LEXT OLS5100)

Measurement of Volume

Olympus OLS5100 laser confocal Microscope provides us Volume and surface area for peak and valley. An ideal silicon wafer will have a homogeneous peak in height and volume and no blank zone as a valley.We can measure the volume of peaks separately to understand individual peak volume and its average so that we can optimize the etching process to achieve homogeneous peaks. Volume of the valley can also be measured as a separate value so that one can understand the process where you have a minimum black zone as a valley. White region in any laser image is a blank undesired region. Similarly, we have surface area to guide us for optimization on the etching process for desired peak and reduced blank zone as valley. Silicon Wafer Etching using Olympus LEXT OLS5100

Where Spd represents the density of peaks per unit area. Spc represents the arithmetic mean of principal curvature of the peak of surface.

Std This parameter indicates the direction angle of the texture. Therefore, we understand that pyramid like structure in given silicon wafer has angle of 99.6 deg

The PSD parameter helps us to understand the periodicity of the pyramid.

The LEXT OLS5100 Microscope’s Smart Experiment Manager.

Helps make your experiment workflow simpler by automating time-consuming tasks.

• Automatically creates your experiment plan

• Auto populates data to your experiment plan matrix, reducing the chance of input errors

• Clear data trend visualization tools

Olympus OLS5100 laser confocal microscope automatically captures multiple regions on silicon wafer and helps us understand how surface area and surface roughness is changing . It eases the analysis process as it populates all data on one sheet as a head map which eliminates the need to open files individually.

Author- Gyanesh Singh Application Specialist at IR Technology Services Pvt. Ltd Passionate about Microscopy for Micro and Nanostructures. Gyanesh has over 10 years of experience in demonstration and serving application of various techniques to potential clients and enjoys learning new sophisticated scientific technology for Material Science and Life Science.

How to choose the right Industrial Microscope. Every business and industry has its unique requirements when it comes to microscopes. They expect high flexibility and operational readiness. An ideal microscopic solution should provide improved resolution and sample contrast. The industry demands a holistic overview of the type of sample under observation and its features like macro observation, micro observation, 3D height observation, or a combination of all. Industrial Microscopes come in many options. So, we have listed down the latest solutions available for each type of microscope to help you access what is best for your business application.

Laser Confocal Microscopes (How to choose the right Industrial Microscope)

Olympus LEXT OLS5100 combines exceptional accuracy and optical performance with smart tools that make the system easy to use. The tasks of precisely measuring shape and surface roughness at the submicron level are fast and efficient, simplifying your workflow and delivering high-quality data you can trust. It has two optical systems, color imaging and laser confocal, that enables the observer to gather information on sample color and shape in the form of high-definition images. The color imaging optics acquires information using a white-light LED light source and a CMOS image sensor while the laser confocal optics acquire confocal images using a 405 nm laser diode light source and a high-sensitivity photomultiplier. 

The shallow depth of focus enables it to measure the surface irregularities of the sample. The Olympus LEXT OLS5100 is an exceptional laser confocal device that uses a non-destructive observation method. It does not require any sample preparation— all you need to do is place the sample on the stage and it’s ready to measure. Ready to measure. (How to choose the right Industrial Microscope)

Digital Microscopes

The DSX1000 Digital Microscope is the first of its kind with the possibility of observing macro, micro, and 3D features of a sample from 20x to 7000x magnification. It comes with 17 objective lenses, including super long working distance and high numerical aperture options, which provide the flexibility to obtain a wide range of images. The eucentric optical design maintains a good visual field when tilted or when the stage is rotated, enabling you to observe your sample from all possible angles. It displays sample images captured with 6 different observation methods with a single click. Olympus DSX 1000 is an ideal solution for Education, research, forensics, electronics, quality control, metal fabrication, automotive, etc. Packed with a telecentric optical system the DSX1000 guarantees accuracy and repeatability.

Stereo Zoom Microscope (How to choose the right Industrial Microscope)

This type of microscope is ideal for viewing large specimens. Stereo Zoom Microscopes provide the observer with an upright view of the subject as a stereoscopic 3D picture versus a 2D flat image view by compound microscope. They are the choice of microscope for applications such as circuit board repair, circuit board inspection, surface mount technology work, electronics inspection, coin collecting, gemology and gemstone setting, engraving, repair & inspection of small parts, and detecting manufacturing or production flaws in quality control units of various industries. Olympus SZ61/SZ51 is a reliable stereo zoom microscope if you are looking for consistently accurate results from your observations. (How to choose the right Industrial Microscope)

Light Microscope

If your study involves observing fine objects in great detail, a light microscope might just be the tool for you. Light microscopes aided by visible light can detect, magnify and enlarge your specimen to fit your observation needs. They use a series of glass lenses to aim a light beam through the subject and then through convex objective lenses to produce an enlarged view. Olympus Light Microscopes are available in the Upright, Inverted, and Modular version, and are ideal for integration with advanced inspection systems providing versatility for a variety of materials science and industrial applications. (How to choose the right Industrial Microscope)

Measuring Microscope (How to choose the right Industrial Microscope)

Industrial measuring microscopes combine sophisticated optics with a table that enables precise movements to measure targets. Their functional diversity allows them to meet high precision inspection needs. So if you are looking to gather high-performance readings of complex samples, choose a measuring microscope. They provide reliable, accurate, and repeatable measurements on the three axes. Therefore their primary applications include quality control and assembly. Check out the Olympus STM7 for versatility in application and high performance. It is a user-friendly device with high-precision and allows 3-Axis Measurement.

Semiconductor & Flat Panel Display Inspection Microscopes

As the name describes Semiconductor & Flat Panel Display Inspection Microscopes provide high-quality observations for large-sized samples, up to 300 mm wafers, flat panel displays, printed circuit boards, etc. Olympus MX63/MX63L and AL120 are the industry-leading models for these inspection microscopes. (How to choose the right Industrial Microscope)

Cleanliness Inspector (How to choose the right Industrial Microscope)

The practical application of particle size and distribution can directly impact the efficiency, lifespan, and dependability of many manufactured products. Therefore, it is essential to have a reliable solution for particle counting, sizing, and classification. Olympus CIX100 is the most sought after inspection system for manufacturers who maintain high standards for cleanliness of the components they manufacture. It can acquire, process, and document technical cleanliness inspection data in a matter of a few minutes. It has an intuitive software which guides the users step by step through the process, enabling novice operators to acquire cleanliness data with ease.

Industrial microscopes have various applications in major industries like electronics, metals, academic research, glass and ceramics, environment, mining, geology, and others. So it is important to map the functionality of each type to the requirements of your applications. Similar to any industry, the key to making the right decision with microscopy is having the right device for the task at hand. Consider, what you want to observe, what is the nature of your subject, does the subject allow light to pass through and the objective of the observation. This will help you narrow down your search from Industrial Microscopes to Compound/Stereo microscope and further into any type of niche microscopy.

Author- Gyanesh Singh Application Specialist at IR Technology Services Pvt. Ltd Passionate about Microscopy for Micro and Nanostructures. Gyanesh has over 10 years of experience in demonstration and serving application of various techniques to potential clients and enjoys learning new sophisticated scientific technology for Material Science and Life Science.

Surface Roughness Observation of a Diamond with Olympus DSX1000 & OLS5100 Microscopes

Surface Roughness Observation of a Diamonds. Diamonds are among nature’s most precious and beautiful creations. Diamond is much more than the world’s most popular gemstone and the most rigid natural material. But with the glamour comes a few flaws that might result in losing its shine. To maintain the standard quality, it becomes essential to understand the properties, defects and learn about the highly advanced technological solutions to measure them.

Diamond is a solid form of carbon with its atoms arranged in a crystal structure called diamond cubic. At room temperature and pressure, another solid form of carbon known as graphite is the chemically stable carbon form, but diamond seldom converts.

It has the highest hardness and thermal conductivity of any natural material, properties utilized in major industrial applications such as cutting and polishing tools. Rough diamonds are mined and converted into gems through a multi-step process known as “cutting”. Diamonds are rigid but also brittle and can be split up by a single blow. Therefore, diamond cutting is traditionally considered a delicate procedure requiring skills, scientific knowledge, tools and experience. Its final goal is to produce a faceted jewel where the specific angles between the facets would optimize the diamond luster, that is, dispersion of white light. In contrast, the number and area of facets would determine the weight of the final product. (Surface Roughness Observation of a Diamond)

(Surface Roughness Observation of a Diamond)Some of them may be considered classical, such as round, pear, marquise, oval, hearts and arrows, diamonds, etc. The diamond price depends on cut, color, clarity, and karat. There are certain American certification agencies where the quality of the diamond is certified.

The imperfections in diamonds can be classified as External and Internal Flaw, which can be explained as follows:(Surface Roughness Observation of a Diamond)Some of them may be considered classical, such as round, pear, marquise, oval, hearts and arrows, diamonds, etc. The diamond price depends on cut, color, clarity, and karat. There are certain American certification agencies where the quality of the diamond is certified. The imperfections in diamonds can be classified as External and Internal Flaw, which can be explained as follows:

External Flaws:

• Blemishes: These diamond flaws are present on the surface of a stone and can occur naturally
• Scratches: These are fine lines found on the surface of the diamond. They may have been present naturally or caused when a diamond was cut.
• Extra facets: These are usually cut to remove blemishes or undoubtedly close to surface inclusions on diamonds. At times these different facets are also cut to enhance the brilliance of the diamond.
• Fracture: A breakage in diamonds that is not parallel to the cleavage plane is a fracture. Fractures are usually irregular in shape, making a diamond look chipped (Surface Roughness Observation of a Diamond).
• Fingerprints: Fingerprint inclusions in the shape of fingerprints can sometimes be found in diamonds. However, such inclusions are rare in diamonds as compared to other stones, such as rubies.
• Pits: Small holes may be present on the surface of a diamond. These pits are usually not visible to the naked eye.
• Nicks: Diamonds are also chipped at places, causing the appearance of nicks. It is often repaired by adding extra facets.

Internal Flaws:

• Crystal/mineral inclusions: Some diamonds show the presence of tiny crystals, minerals or other diamonds.
• Pinpoint inclusions: As the name implies, these inclusions are minute crystals, usually white, present inside the diamond.
• Needles: Diamond crystals in a diamond can also be present in the form of long and thin needles. These may not be visible to the naked eye. (Surface Roughness Observation of a Diamond)
• Cloud: The presence of three or more pinpoint inclusions close together can create a haze area, or a cloud, in the diamond.
• Knots: When diamond crystals extend to the surface of the diamond, they are referred to as knots. These can be viewed under proper lighting conditions with a diamond loupe.
• Graining: Crystal inclusions in diamonds occur in the form of lines known as graining. Graining should not be confused with rough diamonds natural grain lines.

Hence to determine the defects and attain superior quality control, we can switch to technologically advanced solutions like The Olympus DSX1000 & The Laser Microscope OLS5100, which have proven excellent performance. For a better understanding, let’s study some of the results obtained through this equipment. (Surface Roughness Observation of a Diamond)

Ø  The Olympus DSX1000 Microscope captures such flows from BF observation, Oblique mode, DIC with contrast enhancement. The below images represent snaps of diamond in different image types like Colour Snap, Extended Height.

IMAGE FROM MICROSCOPE

The below images show the SCRATCHES on the surface of diamond with different observation modes like OBQ and DIC at other objectives.

1. BF + contrast with SXLOB3X Objective

2. DIC Observation with SXLOB3X Objective

3. OBQ Observation with SXLOB3X Objective

4. DIC Observation with SXLOB3X Objective

5. DIC Observation with APO50x Objective

6. The flat surface in DIC (Surface Roughness Observation of a Diamond)

7. Mag-1750X, DIC Observation with APO50X Objective

All other kinds of internal or external flaws like inclusion, fracture, pits, etc. can be explored using polarised light.

Ø  The Laser OLS5100 Microscope offers a 1750X view which allows us to see deformations as a scratch on the surface of the diamond. To find the roughness information for such surface areas in Nanometer, we will have to use the OLS5100 laser microscope, which employs a 405 nm laser source to scan the sample using confocal technique and capture height resolution 6nm.

1. At 2500 x magnification (Surface Roughness Observation of a Diamond)

2. Result View: For example, from the below report, it can be concluded that the Roughness value Ra is 20nm. The maximum peak observed is Rp 58 nm, and the maximum valley followed is Rv 49 nm.

Thus, choosing the right analytical method and tool helps in identification of and defects and accurate measurements to exercise precise quality control. (Surface Roughness Observation of a Diamond)

Author- Gyanesh Singh Application Specialist at IR Technology Services Pvt. Ltd Passionate about Microscopy for Micro and Nanostructures. Gyanesh has over 10 years of experience in demonstration and serving application of various techniques to potential clients and enjoys learning new sophisticated scientific technology for Material Science and Life Science.