Measurement of trace elemental surface contamination


  • For semiconductor processes, a quick contamination inspection is required.
  • Accepts wafers with dimensions of 300 mm, 200 mm, and 150 mm.
    Analytical elements in a wide range (NaU).
  • Sensitivity to light elements (for Na, Mg, and Al).
  • Rigaku’s single target 3-beam technique and XY stage are unique, allowing.
  • ultra-precise ultra-trace examination throughout the whole wafer surface
    For follow-up analysis, import measurement coordinates from defect inspection tools.
  • To address the diverse needs of high-volume production wafer fabs, FOUP, SMIF, and through-the-wall configurations are available.


Cleaning, litho, etch, ashing, films, and other fab operations can all be contaminated using TXRF analysis. With a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system, the TXRF 310Fab can test elements from Na to U.

Rigaku’s unique XY sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software are all included in the TXRF 310Fab. All of these factors lead to increased throughput, precision, and ease of everyday operation.

Sweeping TXRF software, which is available as an option, allows for mapping of contamination distribution throughout the wafer surface to find “hot spots” that can be automatically re-measured with greater precision.

The optional ZEE-TXRF feature overcomes the original TXRF’s 15mm edge restriction, allowing measurements to be taken with zero edge exclusion.

Fully automated front-side and back-side TXRF measurements of 300mm wafers with non-contacting wafer flipping are possible with the optional BAC-TXRF capabilities.

Specifications Table

Product nameTXRF 310Fab
TechniqueTotal reflection X-ray fluorescence (TXRF)
BenefitMeasurement of trace elemental surface contamination
TechnologyThree-beam excitation and automatic optics alignment
Core attributesRotating-anode X-ray source, XYθ sample stage , liquid nitrogen-free detector, accepts 300 mm, 200 mm, and 150 mm wafers
Core optionsGEM-300 automation software for full factory automation, SP-TXRF capability enables mapping of the entire wafer surface, ZEE-TXRF capability enables measurements to zero edge exclusion, BAC-TXRF capability enables fully-automated front-side and back-side measurements
ComputerInternal PC, MS Windows® OS
Core dimensions1200 (W) x 2050(H) x 2546 (D) mm
Mass1380 kg (core unit)
Power requirements3Ø, 200 VAC 50/60 Hz, 30 A