WAFER SURFACE CONTAMINATION METROLOGY BY TXRF
Measurement of trace elemental surface contamination
Cleaning, litho, etch, ashing, films, and other fab operations can all be contaminated using TXRF analysis. With a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system, the TXRF 310Fab can test elements from Na to U.
Rigaku’s unique XY sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software are all included in the TXRF 310Fab. All of these factors lead to increased throughput, precision, and ease of everyday operation.
Sweeping TXRF software, which is available as an option, allows for mapping of contamination distribution throughout the wafer surface to find “hot spots” that can be automatically re-measured with greater precision.
The optional ZEE-TXRF feature overcomes the original TXRF’s 15mm edge restriction, allowing measurements to be taken with zero edge exclusion.
Fully automated front-side and back-side TXRF measurements of 300mm wafers with non-contacting wafer flipping are possible with the optional BAC-TXRF capabilities.
|Product name||TXRF 310Fab|
|Technique||Total reflection X-ray fluorescence (TXRF)|
|Benefit||Measurement of trace elemental surface contamination|
|Technology||Three-beam excitation and automatic optics alignment|
|Core attributes||Rotating-anode X-ray source, XYθ sample stage , liquid nitrogen-free detector, accepts 300 mm, 200 mm, and 150 mm wafers|
|Core options||GEM-300 automation software for full factory automation, SP-TXRF capability enables mapping of the entire wafer surface, ZEE-TXRF capability enables measurements to zero edge exclusion, BAC-TXRF capability enables fully-automated front-side and back-side measurements|
|Computer||Internal PC, MS Windows® OS|
|Core dimensions||1200 (W) x 2050(H) x 2546 (D) mm|
|Mass||1380 kg (core unit)|
|Power requirements||3Ø, 200 VAC 50/60 Hz, 30 A|