Measurement of ultra-trace elemental surface contamination


  • Accepts wafers with dimensions of 300 mm, 200 mm, and 150 mm.
  • Analytical elements in a wide range (NaU).
  • Sensitivity to light elements (for Na, Mg, and Al).
  • Rigaku is the only company that uses a single target 3-beam approach and an XY stage to do ultra trace analysis across the whole wafer surface.
  • VPD preparation that is entirely automated and integrated for maximum sensitivity.
  • Limits of detection: 1E7 atoms/cm2.
  • For follow-up analysis, import measurement coordinates from defect inspection tools.
  • Multitasking: operate the VPD and TXRF at the same time for maximum throughput.


Rigaku NANOPIX SAXS/WAXS measurement system is a new X-ray scattering instrument designed for nano-structure analyses. NANOPIX can be used for both small angle scattering (SAXS) and wide angle scattering (WAXS) measurements, which makes it possible to evaluate multi-scale structures from sub-nanometer to nano-order (0.1 nm to 100 nm). It achieves the highest level of small angle resolution (Qmin to 0.02 nm-1) for a laboratory SAXS instrument.

Specifications Table

Product nameTXRF-V310
TechniqueTotal reflection X-ray fluorescence (TXRF) w/ vapor phase decomposition (VPD)
BenefitMeasurement of ultra-trace elemental surface contamination; 1E7 atoms/cm² detection limits
TechnologyAutomatic VPD preparation, three-beam excitation and automatic optics alignment
Core attributesAutomatic VPD, rotating-anode X-ray source, XYθ sample stage , liquid nitrogen-free detector, accepts 300 mm, 200 mm, and 150 mm wafers
Core optionsGEM-300 automation software for full factory automation, SP-TXRF capability enables mapping of the entire wafer surface, ZEE-TXRF capability enables measurements to zero edge exclusion, BAC-TXRF capability enables fully-automated front-side and back-side measurements
ComputerInternal PC, MS Windows® OS
Core dimensions1200 (W) x 2050(H) x 2990 (D) mm
Mass1650 kg (core unit)
Power requirements3Ø, 200 VAC 50/60 Hz, 125 A