The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.


Designed for high-volume manufacturing

The MFM310 is designed with high-volume 200mm and 300mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with GEM-300/HSMS and factory automation standards, high-reliability machine performance and low power consumption and cost of ownership.

COLORS™ enabling technology

COLORS™ X-ray optics were developed by Rigaku for the MFM310 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own x-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs.

  • Micro-spot X-ray beams and pattern recognition
  • High-throughput, product-wafer measurements
  • Wide range of materials and applications
  • High resolution and precision covering thicknesses from Ångstroms to microns
  • For 200mm and 300mm wafers
  • Available with 300mm factory automation
  • Design based on SEMI S2 and SEMI S8


Wafer size 300mm, 200mm
Load port FOUP, 2 load ports
MFM310 Dimensions 140W x 341D x 205H (cm)
Heat exchanger dimensions 36W x 83.6D x 85H (cm)
MFM310 power requirements 3-phase, 208VAC, 20A, avg., 2kVA
Heat exchanger power requirements 1-phase, 208VAC, 8A, avg., 0.5kVA
Compressed, dry air requirements 0.5 to 0.7 MPa, 20 l/min
Vacuum requirements -80 kPa, 20 l/min


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